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| HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6834 Issued Date : 1998.02.01 Revised Date : 2002.10.24 Page No. : 1/3 HBAV99 HIGH-SPEED SWITCHING DIODE Description The HBAV99 consists of two diodes in a plastic surface mount package. The diodes are connected in series and the unit is designed for high-speed switching application in hybrid thick and thin-film circuits. SOT-23 Features * Small SMD Package (SOT-23) * Ultra-high Speed * Low Forward Voltage * Fast Reverse Recovery Time Absolute Maximum Ratings * Maximum Temperatures Storage Temperature ............................................................................................ -65 ~ +150 C Junction Temperature .................................................................................................... +150 C * Maximum Power Dissipation Total Power Dissipation (Ta=25C) ................................................................................ 250 mW * Maximum Voltages and Currents (Ta=25C) Reverse Voltage .................................................................................................................. 70 V Repetitive Reverse Voltage ................................................................................................. 70 V Forward Current ............................................................................................................. 150 mA Repetitive Forward Current ............................................................................................ 500 mA Forward Surge Current (1ms)....................................................................................... 1000 mA Characteristics (Ta=25C) Characteristic Reverse Breakdown Voltage Forward Voltage Reverse Current Total Capacitance Reverse Recovery Time Symbol V(BR) VF(1) VF(2) VF(3) VF(4) IR CT Trr Condition IR=100uA IF=1mA IF=10mA IF=50mA IF=150mA VR=70 VR=0, f=1MHz IF=IR=10mA, RL=100 measured at IR=1mA Min 70 Max 715 855 1000 1250 2.5 1.5 6 Unit V mV mV mV mV uA pF nS HBAV99 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Forward Biased Voltage & Forward Current 450 1 Spec. No. : HE6834 Issued Date : 1998.02.01 Revised Date : 2002.10.24 Page No. : 2/3 Capacitance & Reverse-Biased Voltage Current-IF (mA) 300 150 0 0 500 1000 1500 2000 Capacitance-Cd (pF) 0.1 0.1 1 10 100 Forward Biased Voltage-VF (mV) Reverse Biased Voltage-VR (V) Power Derating 300 250 PD(mW), Power Dissipation 200 150 100 50 0 0 20 40 o 60 80 100 120 140 160 Ta( C ), Ambient Temperature HBAV99 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. SOT-23 Dimension Diagram: L Spec. No. : HE6834 Issued Date : 1998.02.01 Revised Date : 2002.10.24 Page No. : 3/3 A Marking: 3 BS 1 V G 2 A7 Rank Code Control Code 3-Lead SOT-23 Plastic Surface Mounted Package HSMC Package Code: N C Style: Pin 1.Anode 2.Cathode 3.Common Connection *: Typical D H K J DIM A B C D G H Inches Min. Max. 0.1102 0.1204 0.0472 0.0630 0.0335 0.0512 0.0118 0.0197 0.0669 0.0910 0.0005 0.0040 Millimeters Min. Max. 2.80 3.04 1.20 1.60 0.89 1.30 0.30 0.50 1.70 2.30 0.013 0.10 DIM J K L S V Inches Min. Max. 0.0034 0.0070 0.0128 0.0266 0.0335 0.0453 0.0830 0.1083 0.0098 0.0256 Millimeters Min. Max. 0.085 0.177 0.32 0.67 0.85 1.15 2.10 2.75 0.25 0.65 Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material: * Lead: 42 Alloy; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: * Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 * Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HBAV99 HSMC Product Specification |
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